Bela F Nagy

US Patent:

6466446, Oct 15, 2002

Filed:

Jul 1, 1994

Appl. No.:

08/269706

Inventors:

Bela Nagy - Acton MA
Arjun Partha - Hudson MA

Assignee:

Saint Gobain/Norton Industrial Ceramics Corporation - Worcester MA

International Classification:

H05K 720

US Classification:

361708, 257675, 361723

Abstract:

An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate.

US Patent:

44266090, Jan 17, 1984

Filed:

May 1, 1981

Appl. No.:

6/259726

Inventors:

Bela G. Nagy - Acton MA
Alfredo H. Saab - Malden MA

Assignee:

Sprague Electric Company - North Adams MA

International Classification:

H02P 540

US Classification:

318729

Abstract:

A power factor controller for a motor is of the type having a bidirectional triode thyristor and a circuit for sensing the voltage across the thyristor to determine the time by which the current lags the line voltage and for generating a signal voltage across an integrating capacitor that is inversely proportional to the current lag time. In addition, a voltage ramp generator produces a ramp voltage having a slope that increases as the lag time decreases. A sum of the signal voltage and ramp voltage is applied to the input of a threshold detector that triggers firing of the thyristor when a predetermined threshold is reached. The entire controller employs only five integrated switches or gates and two individual transistors, and power dissipation, size and cost are thereby minimized.

US Patent:

55043038, Apr 2, 1996

Filed:

Dec 12, 1994

Appl. No.:

8/353753

Inventors:

Bela G. Nagy - Acton MA

Assignee:

Saint-Gobain/Norton Industrial Ceramics Corp. - Worcester MA

International Classification:

B23K 2600
G01B 1130

US Classification:

21912168

Abstract:

A combination measuring and ablation laser apparatus is provided which generally includes an ablating laser, a profilometer laser, an automatic feedback control unit and electro-mechanical positioning apparatus. The combination measuring and ablation laser apparatus can have a single multi-mode laser having an ablating mode and a measuring mode and a positioning means for positioning the laser between ablating and measuring modes. In operation, the profilometer laser measures the thickness of a diamond sample and compares it to the desired thickness. Where the measured thickness is too large, the feedback control unit activates the ablating laser for a predetermined time interval to smoothen any irregularities which may be contributing to the diamond sample thickness. At the end of the time interval, the portion is remeasured by the profilometer laser to determine if it conforms to the desired thickness. If the portion still fails to conform to the desired thickness, the feedback control unit repeats the steps of positioning and activating the ablation laser to further ablate the portion.

US Patent:

56533780, Aug 5, 1997

Filed:

May 25, 1995

Appl. No.:

8/450816

Inventors:

Eric E. Olson - Bolton MA
Bela G. Nagy - Acton MA

Assignee:

Saint Gobain/Norton Industrial Ceramics Corporation - Worcester MA

International Classification:

B23K 3102
C23C 1600

US Classification:

2281241

Abstract:

Precision measuring instruments having highly parallel and wear-resistant contact members and a method for fabricating these contact areas are disclosed. The measuring instruments preferably include two contact members each having diamond coated ceramic substrates. The method for diamond coating the contact members of the measuring instruments includes, for each contact member, preparing a ceramic substrate to high tolerance so that it has two surfaces which are parallel within 0. 25 microns, diamond coating one surface of the substrate by any one of several chemical vapor deposition (CVD) techniques, and metalizing the other surface of the substrate for affixing it to the contact member of the measuring instrument. The metalized surface of the substrate is preferably affixed to the contact members of the measuring instrument by brazing, gluing or welding. Preferred embodiments of the measuring instruments with diamond coated contact areas include calipers and micrometers.

US Patent:

51399733, Aug 18, 1992

Filed:

Dec 17, 1990

Appl. No.:

7/628513

Inventors:

Bela G. Nagy - Acton MA
Leonard G. Feinstein - Westborough MA
Yehya M. Kasem - Northboro MA

Assignee:

Allegro Microsystems, Inc. - Worcester MA

International Classification:

H01L 2156
H01L 2158
H01L 2160

US Classification:

437211

Abstract:

A lead frame and die sub-assembly is first manufactured by a conventional method including bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is stacked first adjacent a dielectric plastic sheet that is in turn stacked against a metal heat spreader block. The dielectric sheet has a centrally located hole registered with the die attach pad. A dollop of an uncured resin is dispensed in the gap between the die attach pad and block. This assembly is compressed between two hot platens whereby the lead fingers, dielectric sheet and the block are bonded together and the resin dollop is flattened to a controlled thickness, namely the thickness of the dielectric sheet. The thickness of the dielectric sheet controls the flattened thickness of the cured resin dollop. After the platens are withdrawn, the local portion of the lead frame having been bonded in the stack is then put into a mold and the stack assembly encapsulated in a thermosetting resin to produce the semiconductor package.

US Patent:

55675255, Oct 22, 1996

Filed:

Jun 1, 1995

Appl. No.:

8/458002

Inventors:

Rakesh R. Kapoor - Shrewsbury MA
Bela G. Nagy - Acton MA
Louis K. Bigelow - Boylston MA

Assignee:

Saint-Gobain/Norton Industrial Ceramics Corporation - Worcester MA

International Classification:

B24D 1100

US Classification:

428408

Abstract:

The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vanadium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15. degree.

US Patent:

56966652, Dec 9, 1997

Filed:

Apr 22, 1996

Appl. No.:

8/636180

Inventors:

Bela G. Nagy - Acton MA

Assignee:

Saint-Gobain/Norton Industrial Ceramics Corporation - Worcester MA

International Classification:

H05K 720

US Classification:

361723

Abstract:

An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond or diamond-coated silicon carbide or molybdenum, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate. The thermal connection can be by bonding the pins directly to the substrate.

US Patent:

55231586, Jun 4, 1996

Filed:

Jul 29, 1994

Appl. No.:

8/283311

Inventors:

Rakesh R. Kapoor - Shrewsbury MA
Bela G. Nagy - Acton MA
Louis K. Bigelow - Boylston MA

Assignee:

Saint Gobain/Norton Industrial Ceramics Corp. - Worcester MA

International Classification:

B24D 1100

US Classification:

428408

Abstract:

The reliability of a braze joint formed between a diamond film and a tungsten carbide body is increased by use of a vandium containing braze. The braze joint exhibits an average shear strength greater than about 40,000 pounds per square inch, (276 MPa) and the braze exhibits a contact angle with the diamond film of less than about 15. degree.