Ashod S Dostoomian

US Patent:

46961046, Sep 29, 1987

Filed:

Aug 12, 1986

Appl. No.:

6/895633

Inventors:

Riccardo Vanzetti - Brockton MA
Ashod S. Dostoomian - Stoughton MA

Assignee:

Vanzetti Systems, Inc. - Stoughton MA

International Classification:

H05K 334

US Classification:

29840

Abstract:

A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow solderiung utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material. The infrared detector also continues to sense the thermal radiation from the heated solder material during cool down to provide a signal which will be compared with a standard signal to determine the quality of the solder joint.

US Patent:

44814186, Nov 6, 1984

Filed:

Sep 30, 1982

Appl. No.:

6/429397

Inventors:

Riccardo Vanzetti - Brockton MA
Ashod S. Dostoomian - Stoughton MA
Alan C. Traub - Framingham MA

Assignee:

Vanzetti Systems, Inc. - Stoughton MA

International Classification:

G01J 100

US Classification:

250338

Abstract:

An apparatus for inspecting a device made up of a plurality of different infrared radiating elements includes an optical head which is moveable along X-Y coordinates above the fixed device to sequentially scan the infrared radiating elements. A laser beam source is operatively connected to the moveable head for injecting thermal energy into the infrared radiating elements and an infrared detector is provided for sensing the infrared radiation emanating from the elements. The infrared detector may be mounted directly on the moveable head or in a remote location wherein the detector would be connected to the moveable head by a flexible optical fiber. A second moveable head may be located on the opposite side of the device so that thermal energy from the laser source may be injected into opposite sides of the infrared radiating element.

US Patent:

42252300, Sep 30, 1980

Filed:

Aug 2, 1978

Appl. No.:

5/930268

Inventors:

Ashod S. Dostoomian - Stoughton MA
Joseph S. Lord - Walpole MA

Assignee:

Vanzetti Infrared & Computer Systems Incorporated - Canton MA

International Classification:

G01J 560

US Classification:

356 45

Abstract:

A band-ratio radiometer is disclosed which makes use of either a bifurcated or trifurcated fiber optic bundle, over two branches of which the sample radiation is transmitted in different wavelength regions. The third branch may be used to provide illumination of the target area, for aiming purposes, by injecting light at the near end of this branch. By this means, the remote ends of all three bundles may be focussed precisely upon the target area, with no parallax problem. The system avoids the use of conventional optical filters by making use of detectors which are identical in wavelength sensitivity and optical fibers which differ in wavelength transmittance.

US Patent:

44445164, Apr 24, 1984

Filed:

Feb 2, 1982

Appl. No.:

6/345130

Inventors:

Ashod S. Dostoomian - Stoughton MA
Joseph S. Lord - Walpole MA
Jeffrey R. Davis - Weymouth MA

Assignee:

Vanzetti Infrared and Computer Systems, Inc. - Stoughton MA

International Classification:

G01J 500
G02B 516

US Classification:

374131

Abstract:

An infrared temperature probe for high pressure use is in the form of a hollow bolt adapted to be threaded into a complementary threaded aperture in the wall of a pressure vessel with the end thereof disposed flush with the internal surface of the pressure vessel wall. An infrared transparent window is secured in the end of the hollow bolt with one surface thereof disposed flush with the end of the bolt. A bundle of optical fibers is secured within the opposite end of the hollow bolt and a glass rod is mounted within the hollow bolt in operative relation to the window and the optical fiber bundle for transmitting infrared radiation from the window to the optical fiber bundle. The interior of the hollow bolt may be supplied with a circulating cooling liquid or gas. An infrared temperature probe can also be used with a mold having an aperture for receiving an ejector pin wherein the hollow ejector pin is provided with an impact surface at one end and an infrared transparent window in the opposite end for receiving infrared radiation from a hot molded article within the mold when the ejector pin is located within the aperture in the mold. A bundle of optical fibers extends through the hollow ejector pin and is disposed in optical transmitting engagement with the window.

US Patent:

46571698, Apr 14, 1987

Filed:

Jun 11, 1984

Appl. No.:

6/619438

Inventors:

Ashod S. Dostoomian - Stoughton MA
Riccardo Vanzetti - Brockton MA

Assignee:

Vanzetti Systems, Inc. - MA

International Classification:

B23K 3100

US Classification:

228103

Abstract:

The melting of solder in a reflow soldering operation is detected by examining the rate of change of the solder temperature or by detecting a change in a surface reflectance characteristic of the solder which occurs upon melting.

US Patent:

46961011, Sep 29, 1987

Filed:

Sep 19, 1986

Appl. No.:

6/908920

Inventors:

Riccardo Vanzetti - Brockton MA
Ashod S. Dostoomian - Stoughton MA

Assignee:

Vanzetti Systems, Inc. - Stoughton MA

International Classification:

B23P 1900

US Classification:

29740

Abstract:

A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow soldering utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material. The infrared detector also continues to sense the thermal radiation from the heated solder material during cool down to provide a signal which will be compared with a standard signal to determine the quality of the solder joint.