A semiconductor packaging system includes a semiconductor die and a solder pillar on a side of the semiconductor die extending outwardly from a side of the semiconductor die. The solder pillar electrically couples to an electrical contact of a packaging substrate, even when access to the electrical contact is limited by a mask.
Qualcomm since Aug 2006
IC Package Development Engineer
Skills:
Semiconductors Ic Failure Analysis Design of Experiments Asic Soc Manufacturing Electronics Packaging Embedded Systems Mixed Signal Engineering Management Cross Functional Team Leadership Simulations Electronics Debugging Product Development Semiconductor Industry Cmos Testing Integrated Circuits Program Management Analog Product Lifecycle Management Six Sigma Product Management Strategy Leadership