Armando C Bottelli

US Patent:

20030162135, Aug 28, 2003

Filed:

Feb 27, 2002

Appl. No.:

10/083914

Inventors:

Uzodinma Okoroanyanwu - Mountain View CA, US
Armando Bottelli - Santa Clara CA, US

Assignee:

Advanced Micro Devices, Inc.

International Classification:

G03F007/20
G03B027/00
G03F007/26

US Classification:

430/394000, 430/313000, 355/018000

Abstract:

An integrated circuit fabrication process for patterning features at sub-lithographic dimensions is disclosed herein. The process includes sequentially exposing a of a film of arylalkoxysilane with a photobase generator, and catalytic amount of water coated on top of a conventional lipophilic photoresist layer provided over a substrate and exposed to a radiation at a first and a second lithographic wavelengths. The first lithographic wavelength is shorter than the second lithographic wavelength. Exposure to the first lithographic wavelength causes a self-aligned mask to form within the photoresist layer.