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Anand Singh Deodutt

age ~62

from Gilbert, AZ

Also known as:
  • Anand S Deodutt
  • Anand D Deodutt
  • Anand B Deodutt
  • Amanda S Deodutt
  • Anand Deodutt Singh
  • Anad S Bouduit
  • Deodutt S Anand
Phone and address:
1119 Iris Dr, Gilbert, AZ 85233
480 545-5729

Anand Deodutt Phones & Addresses

  • 1119 Iris Dr, Gilbert, AZ 85233 • 480 545-5729
  • Jamaica, NY
  • Philadelphia, PA
  • 1119 W Iris Dr, Gilbert, AZ 85233 • 623 594-9783

Work

  • Company:
    Vital thin film mateirals
    Feb 2017
  • Position:
    Project manager

Education

  • School / High School:
    Corentyne High School

Skills

Manufacturing • Lean Manufacturing • Quality Assurance • Process Engineering • Leadership • Continuous Improvement • Management • Cross Functional Team Leadership • Process Improvement • Project Planning • Engineering • Product Development • Purchasing • Manufacturing Operations Management • Process Simulation • Machining • Materials • Design of Experiments • Business Process Improvement • Root Cause Analysis • 5S • Fmea • Kaizen • Business Process • Engineering Management • Manufacturing Engineering • Project Management • Business Development • Customer Service • Failure Analysis • Manufacturing Operations • Microsoft Office • Product Management • Quality System • Reliability • Return on Investment • Analysis • Change Management • Business Strategy • Iso • Inspection • Iso 9000 • Kanban • Machine Tools • Metallurgy • Negotiation • New Business Development • Operations Management • Quality Management • R

Interests

Exercise • Sweepstakes • Home Improvement • Reading • Gourmet Cooking • Sports • Golf • Food • Home Decoration • Health • Photograph • Cooking • Electronics • Outdoors • Fitness • Music • Family Values • Movies • Christianity • Medicine • Automobiles • Travel • Investing • Traveling

Emails

Industries

Computer Hardware

Resumes

Anand Deodutt Photo 1

Project Manager

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Location:
1119 west Iris Dr, Gilbert, AZ 85233
Industry:
Computer Hardware
Work:
Vital Thin Film Mateirals
Project Manager

Transmission Factory Mar 2010 - Dec 2012
Business Consultant

Iss Consulting Mar 2010 - Dec 2012
Senior Engineer

Heraeus 2008 - 2009
Maintenance and Facility Manager

Heraeus 1998 - 2008
Manufacturing Technologist
Education:
Corentyne High School
New Amersterdam Technical Institute
Associates, Associate of Arts, Engineering
Skills:
Manufacturing
Lean Manufacturing
Quality Assurance
Process Engineering
Leadership
Continuous Improvement
Management
Cross Functional Team Leadership
Process Improvement
Project Planning
Engineering
Product Development
Purchasing
Manufacturing Operations Management
Process Simulation
Machining
Materials
Design of Experiments
Business Process Improvement
Root Cause Analysis
5S
Fmea
Kaizen
Business Process
Engineering Management
Manufacturing Engineering
Project Management
Business Development
Customer Service
Failure Analysis
Manufacturing Operations
Microsoft Office
Product Management
Quality System
Reliability
Return on Investment
Analysis
Change Management
Business Strategy
Iso
Inspection
Iso 9000
Kanban
Machine Tools
Metallurgy
Negotiation
New Business Development
Operations Management
Quality Management
R
Interests:
Exercise
Sweepstakes
Home Improvement
Reading
Gourmet Cooking
Sports
Golf
Food
Home Decoration
Health
Photograph
Cooking
Electronics
Outdoors
Fitness
Music
Family Values
Movies
Christianity
Medicine
Automobiles
Travel
Investing
Traveling

Us Patents

  • Wrought Processing Of Brittle Target Alloy For Sputtering Applications

    view source
  • US Patent:
    6599377, Jul 29, 2003
  • Filed:
    Oct 1, 1999
  • Appl. No.:
    09/410014
  • Inventors:
    Michael Bartholomeusz - Phoenix AZ
    Michael Tsai - Phoenix AZ
    Anand Deodutt - Gilbert AZ
  • Assignee:
    Heraeus, Inc. - Chandler AZ
  • International Classification:
    C22C 1907
  • US Classification:
    148425, 148674
  • Abstract:
    An ingot of material which is normally too brittle to allow successful rolling and wrought processing is formed so as to have a thickness-to-width ratio of less than about 0. 5 and is annealed in a temperature range of 1000Â F. to 2500Â F. for a preselected time. The ingot is then rolled in a temperature range of 1500Â F. to 2500Â F. Additional/optional annealing of the resulting rolled plate in a temperature range of 500Â F. to 2000Â F. , or between room temperature and 1500Â F. , and/or a final annealing between 500Â F. and 1500Â F. , is possible. Sputtering targets are cut out of the rolled plate and used for the manufacture of storage disks.
  • High-Ptf Sputtering Targets And Method Of Manufacturing

    view source
  • US Patent:
    20030228238, Dec 11, 2003
  • Filed:
    Jun 7, 2002
  • Appl. No.:
    10/163620
  • Inventors:
    Wenjun Zhang - Gilbert AZ, US
    Bernd Kunkel - Phoenix AZ, US
    Anand Deodutt - Gilbert AZ, US
    Michael Bartholomeusz - Phoenix AZ, US
  • International Classification:
    B22F001/00
  • US Classification:
    419/030000, 428/523000
  • Abstract:
    A target for a deposition apparatus is formed by blending at least two different types of powders together and consolidating the powders with a powder metallurgy process to form a billet. The target is then formed from the billet. The target includes a first material phase having a first PTF and a second material phase having a second PTF higher than the first PTF. The second PTF is also higher than a PTF of a material having the same chemistry as the target.
  • Controlled Cooling Of Sputter Targets

    view source
  • US Patent:
    20050236270, Oct 27, 2005
  • Filed:
    Apr 23, 2004
  • Appl. No.:
    10/829952
  • Inventors:
    Yuanda Cheng - Phoenix AZ, US
    Steven Kennedy - Chandler AZ, US
    Michael Racine - Phoenix AZ, US
    Anand Deodutt - Gilbert AZ, US
  • International Classification:
    C23C014/32
    B44C001/22
  • US Classification:
    204298090, 204298120, 216052000, 216053000
  • Abstract:
    A method for manufacturing a sputter target in which cooling rates are selectively controlled, by generating a sputter surface and a backside surface obverse to the sputter surface. The backside surface includes at least a first textured region. The first textured region aids in cooling a region of the sputter target adjacent to the first textured region, by effectuating heat dissipation.
  • Brittle Metal Alloy Sputtering Targets And Method Of Fabricating Same

    view source
  • US Patent:
    20090010792, Jan 8, 2009
  • Filed:
    Jul 2, 2007
  • Appl. No.:
    11/822065
  • Inventors:
    Wuwen Yi - Tempe AZ, US
    Bernd Kunkel - Phoenix AZ, US
    Carl Derrington - Tempe AZ, US
    ShinHwa Li - Chandler AZ, US
    Anand Deodutt - Gilbert AZ, US
  • Assignee:
    HERAEUS INC. - Chandler AZ
  • International Classification:
    B22F 3/02
    C23C 14/34
  • US Classification:
    419 68, 20429802, 20429813
  • Abstract:
    A method of fabricating a sputtering target assembly comprises steps of mixing/blending selected amounts of powders of at least one noble or near-noble Group VIII metal at least one Group IVB, VB, or VIB refractory metal; forming the mixed/blended powder into a green compact having increased density; forming a full density compact from the green compact; cutting a target plate slice from the full density compact; diffusion bonding a backing plate to a surface of the target plate slice to form a target/backing plate assembly; and machining the target/backing plate assembly to a selected final dimension. The disclosed method is particularly useful for fabricating large diameter Ru—Ta alloy targets utilized in semiconductor metallization processing.
  • Wrought Processing Of Brittle Target Alloy For Sputtering Applications

    view source
  • US Patent:
    6521062, Feb 18, 2003
  • Filed:
    Oct 18, 2000
  • Appl. No.:
    09/690889
  • Inventors:
    Michael Bartholomeusz - Phoenix AZ
    Michael Tsai - Phoenix AZ
    Anand Deodutt - Gilbert AZ
  • Assignee:
    Heraeus, Inc. - Chandler AZ
  • International Classification:
    C22F 110
  • US Classification:
    148674, 148120, 20429813
  • Abstract:
    An ingot of material which is normally too brittle to allow successful rolling and wrought processing is formed so as to have a thickness-to-width ratio of less than about 0. 5 and is annealed in a temperature range of 1000Â F. to 2500Â F. for a preselected time. The ingot is then rolled in a temperature range of 1500Â F. to 2500Â F. Additional/optional annealing of the resulting rolled plate in a temperature range of 500Â F. to 2000Â F. , or between room temperature and 1500Â F. , and/or a final annealing between 500Â F. and 1500Â F. , is possible. Sputtering targets are cut out of the rolled plate and used for the manufacture of storage disks.
Name / Title
Company / Classification
Phones & Addresses
Anand Deodutt
ASD CONSULTING, LLC
Business Consulting Services
1119 W Iris Dr, Gilbert, AZ 85233

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