Amye L Wells

US Patent:

6888223, May 3, 2005

Filed:

Apr 1, 2003

Appl. No.:

10/405763

Inventors:

Donald W. Brouillette - St. Albans VT, US
Joseph D. Danaher - Hinesburg VT, US
Timothy C. Krywanczyk - Essex Junction VT, US
Amye L. Wells - Underhill VT, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L023/048

US Classification:

257621, 257622, 438459, 438667

Abstract:

A structure and method of formation. The substrate has front and back surfaces on opposite sides of the substrate. The substrate has a backside portion extending from the back surface to a second depth into the substrate as measured from the front surface. At least one via is formed in the substrate and extends from the front surface to a via depth into the substrate. The via depth is specific to each via. The via depth of each via is less than an initial thickness of the substrate. The second depth does not exceed the minimum via depth of the via depths. Organic material (e. g. , photoresist) is inserted into each via. The organic material is subsequently covered with a tape, followed by removal of the backside portion of the substrate. The tape is subsequently removed from the organic material, followed by removal of the organic material from each via.

US Patent:

7074715, Jul 11, 2006

Filed:

Nov 15, 2004

Appl. No.:

10/989059

Inventors:

Donald W. Brouillette - St. Albans VT, US
Joseph D. Danaher - Hinesburg VT, US
Timothy C. Krywanczyk - Essex Junction VT, US
Amye L. Wells - Underhill VT, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21/4763

US Classification:

438637, 438638, 438640

Abstract:

A structure and method of formation. The substrate has front and back surfaces on opposite sides of the substrate. The substrate has a backside portion extending from the back surface to a second depth into the substrate as measured from the front surface. At least one via is formed in the substrate and extends from the front surface to a via depth into the substrate. The via depth is specific to each via. The via depth of each via is less than an initial thickness of the substrate. The second depth does not exceed the minimum via depth of the via depths. Organic material (e. g. , photoresist) is inserted into each via. The organic material is subsequently covered with a tape, followed by removal of the backside portion of the substrate. The tape is subsequently removed from the organic material, followed by removal of the organic material from each via.

US Patent:

6455434, Sep 24, 2002

Filed:

Oct 23, 2001

Appl. No.:

10/001562

Inventors:

Chad R. Binkerd - Burlington VT
Jose L. Cruz - Essex Junction VT
Timothy C. Krywanczyk - Essex Junction VT
Brian D. Pfeifer - Milton VT
Rosemary A. Previti-Kelly - Burlington VT
Patricia Schink - Burlington VT
Amye L. Wells - Underhill VT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21302

US Classification:

438692, 438633, 438631

Abstract:

The present invention provides a method of preventing the build-up of polishing material within low areas of a substrate during polishing. Following the blanket deposition of a first layer, a selectively removable material is deposited over the first layer, wherein the selectively removable material fills the low areas. A surface of the substrate is polished removing the excess first layer and selectively removable material from the surface, leaving the first layer and selectively removable material within the low area. Following polishing, the selectively removable material is removed from the low areas prior to the deposition of a second layer.