Gian Francesco Lorusso - Fremont CA Luca Grella - Gilroy CA Douglas K. Masnaghetti - San Jose CA Amir Azordegan - Santa Clara CA
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G01N 2300
US Classification:
250307, 250310, 2504922
Abstract:
The disclosure relates to a method and system of electron beam scanning for measurement, inspection or review. In accordance with one embodiment, the method includes a first scan on a region to collect first image data. The first image data is processed to determine information about a feature in the region. A scanning method is selected for imaging the feature. A second scan using the selected scanning method on the feature is then applied to collect second image data.
Scanning Electron Beam Apparatus And Methods Of Processing Data From Same
Matthew Lent - Livermore CA, US Amir Azordegan - Santa Clara CA, US Hedong Yang - Santa Clara CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
H01J 37/28
US Classification:
250307, 250310, 250311
Abstract:
One embodiment disclosed relates to a scanning electron beam apparatus. The apparatus includes an electron beam column, a scanning system, and a detection system. Circuitry in the apparatus is configured to store detected pixel data from each scan into one of the multiple frame buffers. A multi-frame data processor is configured to analyze the pixel data available in the multiple frame buffers. Another embodiment disclosed relates to a scanning electron beam apparatus having a data processor is configured to process the image data with a filter function having a filter strength, store results of the processing, and repeat the processing and the storing using various filter strengths. The results of the processing may comprise a critical dimension measurement at each filter strength.
Methods Of Stabilizing Measurement Of Arf Resist In Cd-Sem
Amir Azordegan - Santa Clara CA, US Gian Francesco Lorusso - Fremont CA, US Ananthanarayanan Mohan - Santa Clara CA, US Mark Neil - San Jose CA, US Waiman Ng - Los Gatos CA, US Srini Vedula - San Jose CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
H01J 37/26 G01N 23/225
US Classification:
250307, 250310
Abstract:
A method of improving stability for CD-SEM measurements of photoresist, in particular 193 nm photoresist, and of reducing shrinkage of 193 nm photoresist during CD-SEM measurements. The photoresist is exposed to a dose of electrons or other stabilizing beam prior to or during CD measurement. One embodiment of the invention includes multiplexing of the SEM electron beam.
Hedong Yang - Santa Clara CA, US Amir Azordegan - Santa Clara CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G01R 31/305
US Classification:
250307
Abstract:
One embodiment disclosed relates to an automated process for focusing a charged-particle beam in an apparatus onto an area of a substrate. A focusing parameter of the apparatus is set to a value, and intensity data is acquired from the area. The foregoing setting and acquiring steps are repeated for a range of values for the focusing parameter. A focusing sharpness measure is computed for each value of the focusing parameter based on noise in the acquired intensity data, and an in-focus value is determined for the focusing parameter based on the computed focusing sharpness measures. The focusing parameter of the apparatus may be, for example, an objective lens current, or a substrate bias voltage. The computation of the noise-based focusing sharpness measure may involve generating shifted or interleaved signals and calculating correlations between these signals. The focusing may be advantageously performed on an area lacking substantial edge information.
Gian Francesco Lorusso - Fremont CA, US Luca Grella - Gilroy CA, US Douglas K. Masnaghetti - San Jose CA, US Amir Azordegan - Santa Clara CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G01N 23/00
US Classification:
250307, 250398, 250310
Abstract:
The disclosure relates to a method and system of electron beam scanning for measurement, inspection or review. In accordance with one embodiment, the method includes a first scan on a region to collect first image data. The first image data is processed to determine information about a feature in the region. A scanning method is selected for imaging the feature. A second scan using the selected scanning method on the feature is then applied to collect second image data.
Method And Apparatus For Aberration-Insensitive Electron Beam Imaging
Srinivas Vedula - Fremont CA, US Amir Azordegan - Santa Clara CA, US Laurence Hordon - Santa Clara CA, US Alan D. Brodie - Palo Alto CA, US Gian Francesco Lorusso - Leuveen, BE Takuji Tada - San Jose CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G01N 23/00 G21K 7/00 H01J 3/14
US Classification:
250310, 250306, 250307, 250311, 250396 R, 2504923
Abstract:
One embodiment relates to an electron beam apparatus for automated imaging of a substrate surface. An electron source is configured to emit electrons, and a gun lens is configured to focus the electrons emitted by the electron source so as to form an electron beam. A condenser lens system is configured to receive the electron beam and to reduce its numerical aperture to an ultra-low numerical aperture. An objective lens is configured to focus the ultra-low numerical aperture beam onto the substrate surface. Other embodiments are also disclosed.
One embodiment relates to a method of automated microalignment using off-axis beam tilting. Image data is collected from a region of interest on a substrate at multiple beam tilts. Potential edges of a feature to be identified in the region are determined, and computational analysis of edge-related data is performed to positively identify the feature(s). Another embodiment relates to a method of automated detection of undercut on a feature using off-axis beam tilting. For each beam tilt, a determination is made of difference data between the edge measurement of one side and the edge measurement of the other side. An undercut on the feature is detected from the difference data. Other embodiments are also disclosed.
Amir Azordegan - Santa Clara CA Christopher Bevis - Los Gatos CA Bharat Marathe - Cupertino CA David R. Bakker - Cupertino CA
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
H01J 37256
US Classification:
250310, 250307
Abstract:
An apparatus for recording a series of images of a sample over a period of time while varying at least one image parameter. An electron microscope captures images of the sample and also varies the at least one image parameter. A controller triggers the electron microscope to sense multiple images of the sample and also controls the electron microscope to vary the at least one image parameter. An image recorder receives the sensed multiple images and also stores the sensed multiple images as the series of images. A display unit displays the series of images.
Resumes
Senior Vice President And General Manager Electron Beam Product Lines
Kla-Tencor
Senior Vice President and General Manager Electron Beam Product Lines
Kla-Tencor Sep 2014 - Aug 2019
Vice President and Gm, Electron Beam Division
Kla-Tencor Jan 2014 - Sep 2014
Vp, New Products and Disruptive Technologies
Kla-Tencor Jan 2013 - Jan 2014
Vice President of Marketing
Kla-Tencor Jun 2006 - Sep 2010
Senior Director of Marketing
Education:
University of North Texas 1987 - 1995
Doctorates, Doctor of Philosophy, Physics
Skills:
Semiconductors Semiconductor Industry Strategy Metrology Marketing Cross Functional Team Leadership Product Development Engineering Management Product Management Ic Product Lifecycle Management Product Marketing R&D Optics Technical Marketing Manufacturing Product Launch Business Strategy Thin Films Embedded Systems Business Development
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