Abel J Taina

US Patent:

7161764, Jan 9, 2007

Filed:

Aug 23, 2001

Appl. No.:

09/938458

Inventors:

Robert G. Biskeborn - Hollister CA, US
Annayya P. Deshpande - San Jose CA, US
Calvin S. Lo - Saratoga CA, US
Kevin T. Luong - San Jose CA, US
Abel J. Taina - San Jose CA, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 5/187
G11B 5/60

US Classification:

360122, 360129, 360121

Abstract:

A magnetic head according to another embodiment includes a head body including a top face, a bottom face, a pair of elongated side faces, and a pair of short end faces; at least one transducer formed in communication with the top face of the head body; and a single groove formed in the top face of the head body and extending between the transducers and one of the side faces of the head body. A method for manufacturing a magnetic head is also presented.

US Patent:

7274536, Sep 25, 2007

Filed:

Jun 7, 2006

Appl. No.:

11/449443

Inventors:

Annayya P. Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko E. Iben - Santa Clara CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Abel J. Taina - San Jose CA, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 5/127

US Classification:

3602347

Abstract:

A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

US Patent:

7492552, Feb 17, 2009

Filed:

Aug 4, 2007

Appl. No.:

11/833973

Inventors:

Annayya P. Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko E. Iben - Santa Clara CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Abel J. Taina - San Jose CA, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 5/127

US Classification:

3602344

Abstract:

A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

US Patent:

20040223261, Nov 11, 2004

Filed:

May 6, 2003

Appl. No.:

10/431247

Inventors:

Annayya Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko Iben - Santa Clara CA, US
Kevin Luong - San Jose CA, US
Sassan Shahidi - San Jose CA, US
Abel Taina - San Jose CA, US

International Classification:

G11B005/60

US Classification:

360/234700

Abstract:

A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.

US Patent:

20070094866, May 3, 2007

Filed:

Nov 13, 2006

Appl. No.:

11/559311

Inventors:

Robert Biskeborn - Hollister CA, US
Annayya Deshpande - San Jose CA, US
Calvin Lo - Saratoga CA, US
Kevin Luong - San Jose CA, US
Abel Taina - San Jose CA, US

International Classification:

G11B 5/127

US Classification:

029737000, 029603140, 029603070, 029603010

Abstract:

A plurality of apparatuses and methods are provided for improving the manufacture and operational characteristics of thin magnetic film heads. Various embodiments of the present invention provide an apparatus and method for attaching a thin film head to a beam. Other embodiments of the present invention include a system, method and apparatus for dicing a thin film head on a wafer.